Photonixfab Webinar on Packaging Technologies: Part 3

Webinar 3 — Advanced Packaging: Electrical Interconnects, High-Power Optics & Space Applications

The final webinar focuses on advanced packaging challenges and solutions. Topics include establishing reliable electrical connections, integrating high-power optical interfaces, and techniques for free-space optical packaging. We conclude with design considerations for space-grade photonic systems, addressing environmental constraints and reliability requirements. This session is ideal for designers working on demanding applications requiring high performance and long-term stability.

Andrea Alippi is product manager at PHIX Photonics Assembly. Driving the company's portfolio for standard and custom packaging solutions within a broad application range. Expert in early engagement with customers, foundries and other photonic stakeholders addressing PIC and product designs providing guidance toward a design for manufacturing. High focus on PIC packaging technologies like Fiber/Chip-To-Chip and Die/Wire bonding addressing the major PIC technologies as SiPh, SiN, InP, TFLN.PHIX is a globally recognized foundry specializing in the packaging and assembly of PICs and MEMS devices.