Photonixfab Webinar on Packaging Technologies: Part 2

Webinar 2: Photonic Assembly Processes: From Die Prep to Optical Interfaces

This session dives into the core steps of assembling photonic products. We explore back-end processing and die preparation, followed by detailed coverage of passive die bonding and flip-chip techniques. The webinar also addresses the assembly of fiber arrays and spot-size converters, creation of robust optical interfaces, and approaches to thermal packaging. Attendees will gain a clear understanding of the full photonic assembly workflow and the process controls that enable high-quality, repeatable results.

Andrea Alippi is product manager at PHIX Photonics Assembly. Driving the company's portfolio for standard and custom packaging solutions within a broad application range. Expert in early engagement with customers, foundries and other photonic stakeholders addressing PIC and product designs providing guidance toward a design for manufacturing. High focus on PIC packaging technologies like Fiber/Chip-To-Chip and Die/Wire bonding addressing the major PIC technologies as SiPh, SiN, InP, TFLN.PHIX is a globally recognized foundry specializing in the packaging and assembly of PICs and MEMS devices.