Photonixfab Webinar on Packaging Technologies: Part 2

ePIXfab is a not-for-profit open alliance of academic and industrial organizations with a mission to promote silicon photonics science, technology and applications in Europe and the world. ePIXfab acts as a catalyst for European academia and industry to strengthen the worldwide silicon photonics ecosystem.

ePIXfab

Andrea Alippi (PHIX) will present the second of three webinars on Photonic Packaging Technologies.

Photonixfab webinars on photonics

ePIXfab organizes webinars in the context of the photonixFAB project aiming to train the photonics workforce of Europe.

Webinar 2: Photonic Assembly Processes: From Die Prep to Optical InterfacesThis session dives into the core steps of assembling photonic products. We explore back-end processing and die preparation, followed by detailed coverage of passive die bonding and flip-chip techniques. The webinar also addresses the assembly of fiber arrays and spot-size converters, creation of robust optical interfaces, and approaches to thermal packaging. Attendees will gain a clear understanding of the full photonic assembly workflow and the process controls that enable high-quality, repeatable results. Andrea Alippi is product manager at PHIX Photonics Assembly. Driving the company's portfolio for standard and custom packaging solutions within a broad application range. Expert in early engagement with customers, foundries and other photonic stakeholders addressing PIC and product designs providing guidance toward a design for manufacturing. High focus on PIC packaging technologies like Fiber/Chip-To-Chip and Die/Wire bonding addressing the major PIC technologies as SiPh, SiN, InP, TFLN.PHIX is a globally recognized foundry specializing in the packaging and assembly of PICs and MEMS devices.

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Photonixfab Webinar on Packaging Technologies: Part 2

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Photonixfab Webinar on Packaging Technologies: Part 2

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